Aspocomp Group Oyj operates in the Printed circuit boards sector. Aspocomp Group Oyj is a Finland-based holding company engaged in the manufacture of high-tech electronic components and the provision of related services through its subsidiaries. Its principal offerings include metal-back heat sink Printed Circuit Boards (PCBs) and PCB-related design, High Density Interconnections (HDI) with multiple stacked or staggered buildup-layers, high layer count multilayers and RF applications. It operates production plants in Finland (Aspocomp Oulu Oy), Thailand (PCB Center Co Ltd) and in China, through a joint venture (ACP Electronics Co Ltd). Aspocomp Group Oyj's products are used in the telecommunications, automotive, consumer electronics and other industries. Its customers include such companies as Ericsson, Elcoteq, Nokia Siemens Networks, Sanmina-SCI and Wabco. The Company has several subsidiaries, including Aspocomp Ab, Aspocomp GmbH, Aspocomp Holding PTE and Aspocomp Oulu Oy among others. In
our complete report available for purchase the company is compared to: CML Microsystems Plc, Riber and Zytronic PLC.